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This month, save big on popular new releases as well as some old favorites
during this featured event. Discounts valid till 1 November 2002.
Group A
<http://www.chipworks.com/publications/FTR/embedded_DRAM_0206_004.htm>
Embedded DRAM - FTR 0206-004
This first ever study of real world implementations of embedded DRAM
provides some background on the issues and detailed analysis of some current
products.
<http://www.chipworks.com/publications/FTR/embedded_SRAM_0205_002.htm>
Embedded SRAM - FTR 0205-002
A comparative analysis of 13 different devices from 11 different
manufacturers. This study of Microprocessor, DSP and other types of
semiconductor devices looks at real world implementations of embedded SRAM
technology.
On-Die
<http://www.chipworks.com/publications/FTR/on_die_interconnects_0206_00
3.htm> Interconnect Technology - FTR 0206-003
A comparative analysis of 19 different devices from 6 different
manufacturers. On-Die Interconnect is an invaluable resource in providing a
comparison between different manufacturers backend interconnect processes
<http://www.chipworks.com/publications/FTR/shallow_trench_0205_001.htm>
Shallow Trench Isolation - FTR 0205-001
A comparative analysis of 20 different devices from 14 different
manufacturers. This comparative study provides real world examples of how
the STI process has been implemented by a number of different manufacturers.
Buy one Group A Publication and save 20%
Buy two Group A Publications and save 30%
Buy three Group A Publications and save 40%
Group B
FLASH <http://www.chipworks.com/publications/FTR/Flash_9912_007.htm> Memory
Cells - FTR 9912-007
This report describes a comparative analysis of Flash and EEPROM cells on
fourteen different devices by twelve manufacture's
<http://www.chipworks.com/publications/FTR/FlipChip_9912_001A.htm>
Comparative Analysis of Flip-Chip Technology - FTR 9912-001A
Fifteen devices using Flip-Chip Technology from seven different
manufacturer's are analyzed.
New <http://www.chipworks.com/publications/FTR/Wirebonds_9906_006.htm>
Designs for Wirebond Pads - FTR 9906-006
This report describes a comparative analysis of new designs for wirebond
pads on thirteen different devices by ten manufacturer's.
Buy one Group B Publication and save 20%
Buy two Group B Publications and save 30%
Buy three Group B Publications and save 40%
Group C
<http://www.chipworks.com/publications/FTR/HighspeedBuffers.htm>
Comparative Analysis of High Speed Buffers - FTR 0111-001
Selected from Chipworks library of Circuit Analysis, this report provides a
comparative analysis of the Input and Output Buffers of 14 different devices
from 12 different manufacturers.
Comparative
<http://www.chipworks.com/publications/FTR/Analog_Digital_0206_002.htm>
Analysis of Interlevel Dielectric (ILD) and Metalization Technologies
Products included in the analysis are DRAMS, microprocessors and general
logic.
New <http://www.chipworks.com/publications/non_volitile.htm> Technologies
and Trends in Non-Volatile Memory
Learn about the present state of the non-volatile memory market and the new
FeRAM and MRAM technologies.
<http://www.chipworks.com/publications/str.htm> Successful Technologies
Review 2001 (STR)
A compilation of the latest "delivered" technologies, this report contains
photographic illustrations (typically die photos and cross sections) for
each product included, as well as a description of the technology, comments
on manufacturing quality and comparison tables of design rules, layer
thickness, and materials employed.
Save 50% on the purchase of a Group C Publication
Group D
Analog
<http://www.chipworks.com/publications/FTR/Analog_Digital_0206_002.htm> to
Digital Converter
This report will provide an analysis of 6 different analog-to-digital
converter (ADC) circuits from 6 different manufacturers. The circuits
selected will represent a variety of ADC types.
Phase <http://www.chipworks.com/publications/FTR/PLL_0206_001.htm> Locked
Loop (PLL) - FTR 0206-001
Intended for circuit designers, technicians and project managers, this
comparative study provides real world examples of how PLL circuitry has been
implemented by a number of different manufacturers. See what your
competition is doing with regards to PLL design today.
Buy one Group D Publication and save 20%
Buy two Group D Publications and save 30%
Contact Chipworks <mailto:info@chipworks.com?%20subject=Pub%20MK10> to
discover more about our services
<http://www.chipworks.com/services/consulting.htm> and products
<http://www.chipworks.com/products/products.htm> .
If you interested in a topic that we have not already completed, please send
your idea to info@chipworks.com <mailto:info@chipworks.com?%20FTR%20MK> .
Search <http://www.chipworks.com/webreports/webreports.asp> our library of
analysis reports.
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<td width="40"> </td>
<td width="750"> <p class="text">This month, save big on popular
new
releases as well as some old favorites during this featured
event.
Discounts valid till 1 November 2002.</p>
<table width="750" border="1" cellpadding="3" cellspacing="0"
bordercolor="#666666">
<tr valign="top">
<td width="531" class="text"> <p
class="text"><strong>Group A</strong></p>
<p class="text"><a
href="http://www.chipworks.com/publications/FTR/embedded_DRAM_0206_004.htm">
<strong>Embedded
DRAM - FTR 0206-004</strong></a><br>
This first ever study of real world implementations of
embedded
DRAM provides some background on the issues and
detailed analysis
of some current products.</p>
<p class="text"><a
href="http://www.chipworks.com/publications/FTR/embedded_SRAM_0205_002.htm">
<strong>Embedded
SRAM - FTR 0205-002</strong></a><br>
A comparative analysis of 13 different devices from 11
different
manufacturers. This study of Microprocessor, DSP and
other
types of semiconductor devices looks at real world
implementations
of embedded SRAM technology.</p>
<p class="text"><strong><a
href="http://www.chipworks.com/publications/FTR/on_die_interconnects_0206_00
3.htm">On-Die
Interconnect Technology - FTR 0206-003</a><br>
</strong>A comparative analysis of 19 different
devices from
6 different manufacturers. On-Die Interconnect is an
invaluable
resource in providing a comparison between different
manufacturers
backend interconnect processes</p>
<p class="text"><a
href="http://www.chipworks.com/publications/FTR/shallow_trench_0205_001.htm"
><strong>Shallow
Trench Isolation - FTR 0205-001</strong></a><br>
A comparative analysis of 20 different devices from 14
different
manufacturers. This comparative study provides real
world
examples of how the STI process has been implemented
by a
number of different manufacturers. </p>
<p> </p></td>
<td width="175" bgcolor="#CC3333"> <p
class="text"> </p>
<p class="text"><strong><font color="#FFFFFF">Buy one
Group
A Publication and save 20%</font></strong></p>
<p class="text"><strong><font color="#FFFFFF">Buy two
Group
A Publications and save 30%</font></strong></p>
<p class="text"><strong><font color="#FFFFFF">Buy three
Group
A Publications and save 40%</font></strong></p></td>
</tr>
<tr valign="top" bgcolor="#CCCCCC">
<td width="531" class="text"> <p><strong>Group
B</strong></p>
<p><b><a
href="http://www.chipworks.com/publications/FTR/Flash_9912_007.htm">FLASH
Memory Cells</a></b> - FTR 9912-007 <br>
This report describes a comparative analysis of Flash
and
EEPROM cells on fourteen different devices by twelve
manufacture's</p>
<p><b><a
href="http://www.chipworks.com/publications/FTR/FlipChip_9912_001A.htm">
Comparative
Analysis of Flip-Chip Technology</a> - </b>FTR
9912-001A <br>
Fifteen devices using Flip-Chip Technology from seven
different
manufacturer's are analyzed.</p>
<p><b><a
href="http://www.chipworks.com/publications/FTR/Wirebonds_9906_006.htm">New
Designs for Wirebond Pads</a></b> - FTR 9906-006 <br>
This report describes a comparative analysis of new
designs
for wirebond pads on thirteen different devices by ten
manufacturer's.<br>
</p></td>
<td width="175" bgcolor="#CC3333"> <p
class="text"> </p>
<p class="text"><strong><font color="#FFFFFF">Buy one
Group
B Publication and save 20%</font></strong></p>
<p class="text"><strong><font color="#FFFFFF">Buy two
Group
B Publications and save 30%</font></strong></p>
<p class="text"><strong><font color="#FFFFFF">Buy three
Group
B Publications and save 40%</font></strong></p></td>
</tr>
<tr valign="top">
<td width="531" class="text"> <p><strong>Group
C</strong></p>
<p><a
href="http://www.chipworks.com/publications/FTR/HighspeedBuffers.htm"><b>
Comparative
Analysis of High Speed Buffers</b></a> - FTR
0111-001<br>
Selected from Chipworks library of Circuit Analysis,
this
report provides a comparative analysis of the Input
and Output
Buffers of 14 different devices from 12 different
manufacturers.</p>
<p><b><a
href="http://www.chipworks.com/publications/FTR/Analog_Digital_0206_002.htm"
>Comparative
Analysis of Interlevel Dielectric (ILD) and
Metalization Technologies</a></b>
<br>
Products included in the analysis are DRAMS,
microprocessors
and general logic.</p>
<p><b><a
href="http://www.chipworks.com/publications/non_volitile.htm">New
Technologies and Trends in Non-Volatile
Memory</a></b><br>
Learn about the present state of the non-volatile
memory market
and the new FeRAM and MRAM technologies.</p>
<p><a
href="http://www.chipworks.com/publications/str.htm"
target="_blank"><strong>Successful
Technologies Review 2001 (STR)</strong></a><br>
A compilation of the latest "delivered"
technologies,
this report contains photographic illustrations
(typically
die photos and cross sections) for each product
included,
as well as a description of the technology, comments
on manufacturing
quality and comparison tables of design rules, layer
thickness,
and materials employed. <br>
</p></td>
<td width="175" bgcolor="#CC3333"> <p
class="text"> </p>
<p class="text"><strong><font color="#FFFFFF">Save 50%
on the
purchase of a Group C Publication</font></strong></p>
</td>
</tr>
<tr valign="top" bgcolor="#CCCCCC">
<td width="531" class="text"> <p><strong>Group
D</strong></p>
<p><strong><a
href="http://www.chipworks.com/publications/FTR/Analog_Digital_0206_002.htm"
>Analog
to Digital Converter</a><br>
</strong>This report will provide an analysis of 6
different
analog-to-digital converter (ADC) circuits from 6
different
manufacturers. The circuits selected will represent a
variety
of ADC types.</p>
<p><strong><a
href="http://www.chipworks.com/publications/FTR/PLL_0206_001.htm">Phase
Locked Loop (PLL) - FTR 0206-001</a><br>
</strong>Intended for circuit designers, technicians
and project
managers, this comparative study provides real world
examples
of how PLL circuitry has been implemented by a number
of different
manufacturers. See what your competition is doing with
regards
to PLL design today.<br>
</p></td>
<td width="175" bgcolor="#CC3333" class="text"><p> </p>
<p class="text"><strong><font color="#FFFFFF">Buy one
Group
D Publication and save 20%</font></strong></p>
<p class="text"><strong><font color="#FFFFFF">Buy two
Group
D Publications and save 30%</font></strong></p>
<p class="text"><strong></strong></p>
<p><strong></strong></p></td>
</tr>
</table>
<p class="text">Contact <a
href="mailto:info@chipworks.com?%20subject=Pub%20MK10"
target="_blank">Chipworks</a>
to discover more about our <a
href="http://www.chipworks.com/services/consulting.htm">services</a>
and <a
href="http://www.chipworks.com/products/products.htm">products</a>.</p>
<p class="text">If you interested in a topic that we have not
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href="mailto:info@chipworks.com?%20FTR%20MK">info@chipworks.com</a>.</p>
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<P><I><FONT SIZE=2 FACE="Arial"> This e-mail message may contain client privileged and/or confidential information, and is intended only for the use of the individual or entity named above. If you have received this communication in error, please notify us immediately by reply e-mail and delete or discard this message. Thank you.</FONT></I></P>
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